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Service 02

PCB
Design

Two-Layer & Multi-Layer — from simple sensor boards to complex high-speed multilayer designs, optimized for performance and manufacturability.

Overview

Printed Circuit Board (PCB) design is the backbone of any electronics product. At Nexg Automation LLP, our PCB design services cover everything from simple two-layer boards to complex multilayer designs, optimized for performance and manufacturability.

Key Offerings
Schematic Capture & Circuit Design
We convert your system architecture into detailed schematics and logic connections, forming the precise blueprint for every board we build.
Component Selection & Footprint Management
Choosing components that balance price, availability, performance, and manufacturability — ensuring your BOM is optimized from day one.
Layer Stack-Up Planning
For multilayer boards, we design optimal signal, power, and ground layers to control impedance, reduce noise, and facilitate routing.
Routing & Layout Optimization
We route traces for signal integrity, thermal balance, EMI/EMC control, and board reliability — no shortcuts, no compromises.
Design Rule Checks & Validation
We perform DRC, ERC, constraint checks, and simulations to identify and eliminate errors before a single board goes to fabrication.
Prototype Generation & Gerber Output
Manufacturing-ready files (Gerber, ODB++, drill files) with assembly drawings and test points for seamless handoff to production.
DFM / DFA / DFT Considerations
Design-for-manufacturing, design-for-assembly, and design-for-test methods baked into every layout to reduce production risks.
High-Speed / RF / High-Density Support
Advanced layout techniques, microvias, blind/buried vias for signal integrity, controlled impedance, and dense routing requirements.
Why Choose Nexg Automation?

Whether your design is a simple sensor board or a multi-layer, high-speed communication board, we ensure your PCB is robust, reliable, and cost-effective. Our experience spans industrial, consumer, and communication electronics.

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